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solder reflow technique

См. также в других словарях:

  • Bead probe technology — (BPT) gives the electronics industry a new alternative in providing electrical access (called “node access”) to printed circuit board (PCB) circuitry needed to perform In Circuit Testing (ICT). Node access is critical for components on the PCB to …   Wikipedia

  • Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… …   Wikipedia

  • Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… …   Wikipedia

  • Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… …   Wikipedia

  • Flux (metallurgy) — Rosin used as flux for soldering A flux pen used f …   Wikipedia

  • Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents …   Wikipedia

  • nvSRAM — is a type of non volatile computer memory. It is similar in operation to SRAMs. The current market for non volatile memory is dominated by BBSRAMs, or Battery Backed Static Random Access Memory. However, BBSRAMs are slow and suffer from ROHS… …   Wikipedia

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